IMAPS 3D InCites Content Platform

Description

Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularly focused on 3D TSVs. | About 3D InCites The 3D InCites platform operates under the IMAPS umbrella, delivering a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors. Content and media covers a variety of leading technologies, including device and chiplet packaging, advanced thermal solutions, AI driven packaging, 3D integration, heterogeneous integration, photonics/CPO, and next‑generation materials, to name a few. IMAPS purchased the 3D InCites platform in January 2026 from 3D InCites LLC (created and managed by Francoise von Trapp). These longstanding industry resources are now part of the IMAPS portfolio and will c

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